Capability
CAPABILITY
SMT(Surface Mount Technology)
We operate a total of 14 mass production lines and
1 sample line dedicated to meeting customer needs
1 sample line dedicated to meeting customer needs
* Click to view details.
- 1.PCB Loading
- 2.Laser Marking
- 3.Screen Printing
- 4.3D SPI
- 5.Mounting
- 6.Reflow
- 7.3D AOI
- 8.MOI(Manual Optical Inspection)
- 9.ICT(In-Circuit Test)
- 10.PCB Unloading
| SMT | |||
|---|---|---|---|
| Number of Line | 15 Lines | High Speed Pick & Place Capacity | Up to 88,000 CPH |
| Lead - Lead Minimum Distance | 0.2 Pitch | Body - Body | 0.5 mm |
| Part Size (Max) | 0402 ~ 75 mm | Part Height (Max) | ~ 15 mm |
| PCB Size (Max) | Max - 365(L) * 250(W) | PCB Thickness | 0.38 mm ~ 4.2 mm |
| PCB Type | TIN, HASL, OSP, ENIG Dual, Wide PCB |
TrayFeeder | Possibility |
| INSPECTION ABILITY | |||
|---|---|---|---|
| 3D SPI | In-Line | 3D AOI (For SMT) | In-Line |
| 3D AOI (For Selective Soldering) | In-Line | ICT(In Circuit Test) | In-Line |
| X-ray | OffLine (sampling) | XRF Analyzer | OffLine (sampling) |
SMT (Surface Moint Technology)
1. PCB Loading
- A process of loading into the bare printed circuit boards (PCBs)
SMT (Surface Moint Technology)
2. Laser Marking
- A process of engraving a unique serial number (barcode) on each PCB through laser marking
- Unique serial numbers (barcode) are managed via the MES system for process/material traceability and input interlocking
SMT (Surface Moint Technology)
3. Screen Printing
- A process of applying solder cream onto PCBs for component mounting
- After refrigeration, the solder cream should be left at room temperature for a certain period of time, stirred, viscosity checked, and then fed into the production line.
- The MES system enables lifespan management, including tracking the usage count of metal masks and squeezes, and prevents misplacement of metal masks
SMT (Surface Moint Technology)
4. 3D SPI
- A process of inspecting solder application status, including the quantity of applied solder and position
- Manage 3D SPI inspections and the resulting inspection conditions and results
SMT (Surface Moint Technology)
5. Mounting
- A process of mounting chip components and ICs onto solder cream-applied PCBs
- Maintain high productivity through high-speed pick & place mounters
SMT (Surface Moint Technology)
6. Reflow
- The process of melting and cooling solder so that the solder cream between the PCB and the material can harden and be soldered.
- Manage set temperatures, oxygen levels, and conveyor speeds to ensure consistent quality and productivity
SMT (Surface Moint Technology)
7. 3D AOI
- A process of visually inspecting component fit on SMD-finished PCBs
- Improve defect detection and inspection throughput on poor authenticity by RMS operations
SMT (Surface Moint Technology)
8. Manual Optical Inspection (MOI)
- Visual inspection process of component mounting by inspectors using microscopes
SMT (Surface Moint Technology)
9. ICT(In-Circuit Test)
- A process of electrical testing to detect shorts, opens, and missing/reverse-fitted/misplaced components by powering the PCB through ICT fixture pins
SMT (Surface Moint Technology)
10. PCB Unloading
- A process of unloading PCB assemblies with completed SMD and inspection processes into magazines